 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| 46 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module for memory stick unique eject mechanism achieves high operability and 5mm ejection stroke. metal-plated structure enhances noise reduction and mechanical strength. screw clamping structure strengthens mounting. minimized depth design contributes to smaller body structure. ? ? ? features for digital still cameras, digital camcorders, various personal digital assistants and printers for flat panel tvs for notebook pcs ? ? ? applications 1.27mm 50pins 500v ac 1minute structure items specifications type ? compatible numbers of pins type ? , type ? applicable media 5mm media ejection surface mounting type mounting type standard mount/reverse mount mounting style 2 step eject mechanism 0/1.2mm stand-off pin pitch 20 ? to 60 ? 1,000m min. 40m max. 10,000cycles operating temperature range performance contact resistance initial insertion and removal cycle voltage proof insulation resistance initial typical specifications connector for compactflash scfb s eries 47 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module ! " # $ " % & " $ $ & " ! ' pc board mounting hole dimensions viewed from the mounting face side ! ! ! ! "# "# $%% & ' ( ' ) * + * % + , & % ' , & ( , & + . 1 . 1 ! ! " ! # $ %& ' & unit:mm dimensions no. 1 0.3max. 6.3 5 card center 2- 1 43.5 43 pc board mounting side ( 55 ) ( 51.6 ) ( 48.35 ) 17 max. ( 40.9 ) 2.7 1.27 card center 2- 2.54 max. pitch 0.635 1.27 pc board mounting side 0.5 full height card eject travel knob travel 6 4.45 22.15 4.1 6.3 max. 36.4 7.1 max. 4.5 5.3 max. 27.1 range of movement of the lever 3 min. 22.15 32.4 26.1 39.9 22.25 4.1 card end pos. knob lock pos. knob eject pos. 2-m2 p0.4 2-m2 p0.4 0.7 3.5 5 2.15 knob over tra. 8 1.5 #26 #50 #25 #1 2 style standard mount media ejection structure 2 step lever ejection type mounting system stand-off mm 0 ejector scfb3a0300 position of knob right applicable card type ? /type ? drawing no. 1 pin header product no. scfb1a0500 scfb3a0900 left 2 1.2 scfb3a0200 right 3 scfb1a0900 scfb3a1000 left 4 reverse mount 0 scfb3a0400 right 5 SCFB1A0600 scfb3a0500 left 6 product line pin headers and ejectors are supplied as separate parts. to apply these parts, solder the pin header to the printed circuit boa rd, assemble the ejector to the pin header and screw cramp. note 2 step standard type stand off 0mm position of knob: right 2 step standard type stand off 0mm position of knob: left connector for compactflash scfb series 48 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module for memory stick 4 pc board mounting hole dimensions viewed from the mounting face side ! ! " " # $ % & & '! " " '( 1.1 0.7 card center 3.9 ( 53.6 ) 43 5 43.5 pc board mounting side ( 40.9 ) 36.4 1.27 3.35 3.5 2-?.54 max. pitch 0.635 1.27 card eject stroke knob stroke 8 6 1.5 4.45 6.3 max. 7.1 max. 4.5 5.3 max. 27.1 max. range of movement of the lever 2-22.15 32.4 5 27.65 26.1 39.9 22.25 2-m2 p0.4 2-m2 p0.4 2-4.1 card end pos. knob lock pos. knob eject pos. knob over tra. 3 17 max. 3 min. 0.2 max. 7.5 (full height) ( 48.35 ) pc board mounting side 0.5 #1 #25 #50 #26 2-? ! " ## $ # % & ' dimensions no. 3 card end pos. knob over tra. knob eject pos. knob lock pos. card end pos. 2-4.1 2-m2 p0.4 2-m2 p0.4 22.25 39.9 26.1 32.4 2-22.15 3 min. range of movement of the lever 27.1 max. 5.3 max. 4.5 7.1 max. 6.3 max. 4.45 1.5 8 6 knob stroke 5 card eject travel 0.5 1.27 pitch 1.27 3.5 3.35 (40.9) 36.4 17 max. (48.35) pc board mounting side 43.5 43 2- 1 card center 5 0.3 max. 7.5 (full height) 2- 2.54 max. #26 #1 #25 #50 27.65 25.95 5.36 3.9 card center 1.1 pc board mounting side style unit:mm 2 step standard type stand off 1.2mm position of knob: right 2 step standard type stand off 1.2mm position of knob: left connector for compactflash scfb series 49 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module pc board mounting hole dimensions viewed from the mounting face side !" #! !$ % #! & & & & ' !$ ! !" # $ % # " # & " " # ' ( ) * ) ! * &! # $ &% + $ , & + + ' # , & % $ * - - -# - 2.4 8.9 22 27.35 2.25 min. 5.3 3.1 min. 26.65 29.75 2-ground pad 29.45 min. 24.6 min. 23.1 min. ?.2 2- 2-3.6 min. 2-3.6 min. 2.5 min. 26 min. 2-?.6 5.4 2.4 21.75 43.5 ( 0.635 49= ) 31.115 39.9 1.2 ?.1 20.85 max. 9.49 min. 7.1 min. 5 min. 22.65 13.5 min. 4.3 1.35 15.7 min. 27.7 min. #1 #26 pitch 0.635 #50 #25 land area no part mounting no pattern area 2.5 max. width 0.35 0.5 card end pos. dimensions no. 5 !"" ## $ % & ' ( ) ( # ") &# *& % $ "&% + $ ) $ *& + + . 1 . 1 , , , , 6 style unit:mm 2 step reverse type stand off 0mm position of knob: right 2 step reverse type stand off 0mm position of knob: left connector for compactflash scfb series 50 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module for memory stick soldering conditions example of reflow soldering condition reference 1. heating method: double heating method with infrared heater. 2. temperature measurement: thermocouple 0.1 to 0.2 ca k or cc t . 3. temperature profile surface of products 200 100 240 ? (max.) 230 ? (min.) 150 ? 180 ? time (s) 10 sec.(max.) 90 ? 30 sec. room temperature temperature (?c ) pre-heating heating time sec. 1. when soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. caution is therefore required. 2. avoid use of water-soluble soldering flux, since it may corrode the product. 3. check and conform to reflow soldering requirements under actual mass production conditions. 4. pc board warping may alter the characteristics. please take this into consideration when designing patterns and layout. 5. the card specifications are provided by the above manufactures. products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. cautions for using this product small memory card connectors |
Price & Availability of SCFB1A0600
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |